📈Samsung to Double HBM4 Output Next Year
Samsung's HBM4 Output to Skyrocket
TL;DR
Samsung plans to more than double its HBM4 chip production next year, with glass carrier demand set to rise 2.5 times. This surge is driven by increased demand from tech giants like Nvidia.
Samsung is set to more than double its HBM4 chip output next year, with glass carrier demand skyrocketing 2.5 times. This move is crucial for tech giants like Nvidia, who rely on high-bandwidth memory for their latest GPUs. The company's HBM4 and HBM4E products, featuring 12-layer stacks, are already in mass production, with shipments to customers like Nvidia starting in May. By next year, HBM4 is expected to make up 80% of Samsung's HBM shipments, up from 40% this year.
Key Points
Samsung will increase HBM4 output to over double this year's production next year.
Glass carrier demand will rise 2.5 times, from 10,000 sheets/month last year to 25,000 sheets/month next year.
Samsung will clean 50,000 glass carrier sheets/month next year, up from 20,000 this year.
HBM4 and HBM4E products feature 12-layer stacks and are already in mass production.
Samsung provided HBM4E samples to Nvidia in May, with HBM4 expected to make up 80% of shipments next year.
Why It Matters
Tech giants like Nvidia rely on Samsung's HBM4 chips for high-performance GPUs. The 2.5x increase in glass carrier demand signals a significant uptick in HBM4 production, which will likely drive innovation in AI and high-performance computing. However, the $0.20/GB-month premium for HBM4E may only make economic sense for larger-scale deployments.
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